Purification and coatings
Semiconductor and PV industry: high-tech constraints
Purity constraints:
- Our purity processes allow us to achieve extremely low impurity levels, to below 5 ppm.
- The ETV-ICP method is used to detect and monitor impurities to levels below 5 ppb.
Cleanliness constraints:
- Vitreous Carbon Impregnation (VCI) was developed to reduce particle emissions and the vacuum outgassing of materials, particularly for semi-conductor applications.
Resistance to reagents used in plasma processes:
- Mersen products can be coated with a thin layer of pyrolitic carbon thereby reducing the material's permeability to reactive products to a minimum, particularly for semi-conductor applications.
- In order to further enhance the resistance to process reagents, Mersen proposes core impregnation with resin to reduce porosities.
Resistance to hydrogen above 900 °C, MOCVD reagents, and strong acids (HCl, HF)
- Mersen has mastered the deposition of silicon carbide thin films which provides unequalled protection of graphite equipment in particularly harsh environments.
Contact USA
Sales & Engineering
PA 15857-1488 St Marys
+1 814 781 1234
Sales & Engineering
MI 48838 Greenville
+1 616-754 56 71
Sales & Engineering
MI 48708 Bay City
+1 989-894 29 11
Contact USA
Sales & Engineering
PA 15857-1488 St Marys
+1 814 781 1234
Sales & Engineering
MI 48838 Greenville
+1 616-754 56 71
Sales & Engineering
MI 48708 Bay City
+1 989-894 29 11
Product Literature
ETV-ICP OES - detecting limits for high purity carbon and graphite
Download1.82 MB
ETV-ICP OES - detecting limits for high purity carbon and graphiteETV-ICP OES - detecting limits for high purity carbon and graphite
Download1.82 MB
ETV-ICP OES - detecting limits for high purity carbon and graphite